This one-hour webinar will feature two talks from prominent thought-leaders in the area of flexible hybrid electronics (FHE).
Talk 1: High-throughput Printing of Ultrafine Resolution Electronics, Sensors and Wafer Level Packaging on Rigid and Flexible Substrates
This new technology will enable the fabrication of nanoelectronics and allow device designers the use of any organic or inorganic semiconducting, conductive or insulating material on flexible or rigid substrates. The team has already demonstrated the printing of several devices including transistors, inverters, diodes, displays, chemical and biosensors, and interconnects.
Dr. Ahmed Busnaina
William Lincoln Smith Chair
Professor, Distinguished University Professor
Talk 2: Flexible Hybrid Electronics In Space
The Lockheed Martin Space site in Billerica, Massachusetts is tasked to develop, demonstrate, assess and transition leading-edge and novel electronics for defense and intelligence applications. The facility has 5,000 square feet of cleanroom space and was designed and built to accommodate a high mix of integrated circuit research and development projects including GaN RF devices, high temperature and radiation tolerant electronics, flexible thin-film electronics, nanomaterial coatings and synthetic biology. Dr. Jonathan Nichols will discuss potential applications that could benefit from Flexible Hybrid Electronics (FHE) technology and give an overview of current and past Lockheed Martin NextFlex projects.
Dr. Jonathan Nichols
Senior Staff Materials Engineer